Txawm hais tias Samsung yog thawj zaug pib 3nm ntau lawm chips thiab los ntawm ob peb lub hlis ua ntej TSMC, zoo li nws txoj kev siv zog hauv daim teb no tsis tau ua tiav Apple txaus siab. Lub Cupertino loj tshaj tawm tau xaiv TSMC es tsis txhob ntawm Kaus Lim Kauslim rau kev tsim nws lub neej yav tom ntej M3 thiab A17 Bionic chips.
Cov duab thaij duab
Apple lub neej yav tom ntej M3 thiab A17 Bionic chips yuav ua raws li lub vev xaib cov ntaub ntawv Asian Nikkei tsim siv TSMC's N3E (3nm) txheej txheem. Apple nws yuav zaum tseg A17 Bionic chipset rau cov qauv iPhone muaj zog tshaj plaws nws yuav tshaj tawm xyoo tom ntej, thaum nws tuaj yeem siv A16 Bionic nti rau cov pheej yig dua.
Koj tuaj yeem txaus siab rau
Thaum Samsung yeej tsis muaj lub luag haujlwm rau kev tsim cov kua M1 thiab M2 computer chips tam sim no, nws ua rau yav dhau los ua tau, thiab raws li cov neeg soj ntsuam kev lag luam nti, tib yam yog qhov tseeb rau yav tom ntej. Txawm hais tias cov chips no yog tsim los ntawm TSMC, qee cov khoom yog Apple muab rau lwm lub tuam txhab, suav nrog Samsung. Lub Kaus Lim Kauslim, qhov tseeb dua nws Samsung Electro-Mechanics faib, tshwj xeeb yog muab FC-BGA (Flip-Chip Ball Grid Array) substrates rau M1 thiab M2 chipsets. Cov substrates no yuav tsum muaj rau kev tsim cov processors thiab cov duab kos nrog cov khoom sib xyaw ua ke siab.
