Samsung lub tuam txhab semiconductor Samsung Foundry tau hais thaum lub sijhawm Samsung Foundry 2022 qhov kev tshwm sim tias nws yuav txuas ntxiv txhim kho nws cov semiconductor chips kom lawv me dua, sai dua thiab muaj zog dua. Txog rau qhov kawg no, nws tshaj tawm nws cov phiaj xwm los tsim 2 thiab 1,4nm chips.
Cov duab thaij duab
Tab sis ua ntej, cia peb tham txog lub tuam txhab 3nm chips. Ob peb lub hlis dhau los, nws pib tsim lub ntiaj teb thawj 3nm chips (siv cov txheej txheem SF3E) nrog GAA (Gate-All-Around) thev naus laus zis. Los ntawm cov thev naus laus zis no, Samsung Foundry cog lus tias muaj kev txhim kho loj hauv kev siv hluav taws xob. Los ntawm 2024, lub tuam txhab npaj yuav tsim lub thib ob tiam ntawm 3nm chips (SF3). Cov chips no yuav tsum muaj qhov thib tsib me me transistors, uas yuav tsum tau ua kom muaj zog ntxiv. Ib xyoos tom qab, lub tuam txhab npaj yuav tsim lub cim thib peb ntawm 3nm chips (SF3P +).
Raws li rau 2nm chips, Samsung Foundry xav pib tsim lawv hauv 2025. Raws li thawj Samsung chips, lawv yuav feature Backside Power Delivery thev naus laus zis, uas yuav tsum txhim kho lawv cov kev ua tau zoo tag nrho. Intel npaj yuav ntxiv nws cov qauv ntawm cov thev naus laus zis no (hu ua PowerVia) rau nws cov chips thaum ntxov li 2024.
Koj tuaj yeem txaus siab rau
Raws li rau 1,4nm chips, Samsung Foundry npaj yuav pib tsim lawv hauv 2027. Lub sijhawm no, nws tsis paub tias lawv yuav txhim kho dab tsi. Tsis tas li ntawd, lub tuam txhab tshaj tawm hais tias los ntawm 2027 nws npaj siab yuav triple nws cov peev txheej chips piv rau xyoo no.
