Ob lub chipsets siv nyob rau hauv cov xov tooj series Galaxy S22, Exynos 2200 thiab Snapdragon 8 Gen 1, yog lub zog tshaib plab thiab kub dhau, ua rau kev poob siab ntawm kev ua si thiab roj teeb lub neej tsis zoo. Yuav luag tag nrho lwm cov flagships ntsib qhov teeb meem no Android xov tooj los ntawm lub xyoo no. Txawm li cas los xij, Samsung lub foldable smartphones yav tom ntej tuaj yeem zam lawv.
Raws li ib tug hwm Ice ntug leaker, yuav muaj "benders" Galaxy Los ntawm Fold4 a Los ntawm Flip4 powered los ntawm Snapdragon 8 Gen 1+ chipset (qee zaum npe hu ua Snapdragon 8 Gen 1 Plus). Qualcomm tseem tsis tau nthuav tawm cov nti tam sim no, tab sis raws li cov ntaub ntawv sau tseg, nws tau tsim los ntawm TSMC's 4nm txheej txheem, ua rau nws siv zog ntau dua piv rau Exynos 2200 thiab Snapdragon 8 Gen 1 (cov chips no tau tsim los siv Samsung's 4nm txheej txheem).
Cov duab thaij duab
Lub tshuab hluav taws xob semiconductor nti ntawm TSMC cov chaw tsim khoom ib txwm ua tau zoo tshaj qhov uas siv los ntawm Samsung lub chaw tsim khoom, Samsung Foundry. Nws tsis yog qhov xav tsis thoob tias Taiwanese semiconductor loj heev kuj tau xaiv los tsim nws cov A thiab M series chipsets hauv ob peb xyoos tom ntej no. Apple.
Koj tuaj yeem txaus siab rau
Thaum qhov no yeej yog kev poob siab rau Samsung Foundry, rau Samsung MX (Mobile Experience) faib, uas tsim cov smartphones thiab ntsiav tshuaj ntawm lwm yam. Galaxy, ntawm qhov tsis sib xws, nws yog xov zoo. Nws tuaj yeem cia siab tias Galaxy Z Fold4 thiab Z Flip4 yuav muab kev ua haujlwm siab dua thiab roj teeb lub neej ntau dua li cov koob Galaxy S22 thiab tiam tam sim no ntawm Samsung "puzzles".
